Dicyandiamide - Electronic Grade

Chemical Formula: C2H4N4
Molecular Weight: 84.08
CAS No. 461-58-5

Material Safety Data Sheet (Dicyandiamide)
Product Description

Usage: Used as curing agent for epoxy adhesive in FR-4 CCL production.
 
Appearance: White Crystal
 
Package: Net 25kg kraft paper bags.
 
Specification:
 
Specification
Purity %≥
Moisture %≤
Ash content %≤
Calcium content μg/g ≤
Fe Content μg/g ≥
Melting point ºC
Solubility
Superfine Grade
99.8
0.20
0.03
25
2
209-212
Passable